Thomas Brunschwiler
Thomas Brunschwiler
IBM Research
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TitleCited byYear
Cloud computing
B Hayes
Communications of the ACM 51 (7), 9-11, 2008
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 463-470, 2010
Forced convective interlayer cooling in vertically integrated packages
T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ...
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
Interlayer cooling potential in vertically integrated packages
T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ...
Microsystem Technologies 15 (1), 57-74, 2009
Direct liquid jet-impingment cooling with micron-sized nozzle array and distributed return architecture
T Brunschwiler, H Rothuizen, M Fabbri, U Kloter, B Michel, RJ Bezama, ...
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
AK Coskun, D Atienza, TS Rosing, T Brunschwiler, B Michel
Proceedings of the Conference on Design, Automation and Test in Europe, 111-116, 2010
Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
W Escher, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132 (8), 081402, 2010
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
PS Andry, TJ Brunschwiler, EG Colgan, JH Magerlein
US Patent 7,990,711, 2011
On the cooling of electronics with nanofluids
W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, ...
Journal of heat transfer 133 (5), 051401, 2011
Hysteretic electroluminescence in organic light-emitting diodes for spin injection
G Salis, SF Alvarado, M Tschudy, T Brunschwiler, R Allenspach
Physical Review B 70 (8), 085203, 2004
What is an author
B Michel, H Walter, A Grams, M Seckel, T Löher, O Wittler, KD Lang, ...
The Foucault Reader, New York: Pantheon Books, 1984
Toward zero-emission data centers through direct reuse of thermal energy
T Brunschwiler, B Smith, E Ruetsche, B Michel
IBM Journal of Research and Development 53 (3), 11: 1-11: 13, 2009
Energy efficient hotspot-targeted embedded liquid cooling of electronics
CS Sharma, MK Tiwari, S Zimmermann, T Brunschwiler, G Schlottig, ...
Applied Energy 138, 414-422, 2015
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
A Sridhar, A Vincenzi, D Atienza, T Brunschwiler
IEEE Transactions on Computers 63 (10), 2576-2589, 2013
Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55 (5), 15: 1-15: 13, 2011
3D integrated water cooling of a composite multilayer stack of chips
F Alfieri, MK Tiwari, I Zinovik, D Poulikakos, T Brunschwiler, B Michel
Journal of Heat Transfer 132 (12), 121402, 2010
Semiconductor device with a high thermal dissipation efficiency
TJ Brunschwiler, M Despont, MA Lantz, B Michel, P Vettiger
US Patent 7,928,565, 2011
Heat-removal performance scaling of interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, W Cesar, Y Leblebici, ...
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010
Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 16th International workshop on thermal investigations of ICs and …, 2010
Variable flow computer cooling system for a data center and method of operation
TJ Brunschwiler, RJ Linderman, B Michel, EM Ruetsche
US Patent 7,808,780, 2010
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