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Co-authors
- Feng LiuProfessor, Department of Materials Science and Engineering, University of UtahVerified email at eng.utah.edu
- Tony LowU of Minnesota, IBM Research, Columbia U, Purdue U, National U SingaporeVerified email at us.ibm.com
- Huaqing HuangSchool of Physics, Peking UniversityVerified email at pku.edu.cn
- Jia-Wei MeiSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Yugui YaoBeijing Institute of TechnologyVerified email at bit.edu.cn
- shunhong zhangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Zhengfei WangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Delin ZhangSchool of Electronic and Information Engineering, Tiangong University; University of MinnesotaVerified email at tiangong.edu.cn
- Kyung-Hwan JinDepartment of Physics, Jeonbuk National UniversityVerified email at jbnu.ac.kr
- Bing HuangBeijing Computational Science Research Center & Beijing Normal UniversityVerified email at csrc.ac.cn
- Jiadong ZhouBeijing Institute of Technology, Nanyang Technological UniversityVerified email at bit.edu.cn
- Dali SunNorth Carolina State UniversityVerified email at ncsu.edu
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Wei Jiang (蒋伟)
Beijing Institute of Technology, University of Minnesota, University of Utah
Verified email at bit.edu.cn - Homepage