| Thickness dependent critical strain in submicron Cu films adherent to polymer substrate RM Niu, G Liu, C Wang, G Zhang, XD Ding, J Sun Applied Physics Letters 90 (16), 2007 | 138 | 2007 |
| Microstructure and properties of nanostructured Cu28 wt% Ag microcomposite deformed after solidifying under a high magnetic field X Zuo, K Han, C Zhao, R Niu, E Wang Materials Science and Engineering: A 619, 319-327, 2014 | 64 | 2014 |
| Microstructure and strengthening mechanism of oxide lanthanum dispersion strengthened molybdenum alloy GJ Zhang, YJ Sun, RM Niu, J Sun, JF Wei, BH Zhao, LX Yang Advanced Engineering Materials 6 (12), 943-948, 2004 | 55 | 2004 |
| Simultaneously increasing strength and electrical conductivity in nanostructured Cu–Ag composite C Zhao, X Zuo, E Wang, R Niu, K Han Materials Science and Engineering: A 652, 296-304, 2016 | 50 | 2016 |
| Nucleation and growth of γ-Fe precipitate in Cu-2% Fe alloy aged under high magnetic field X Zuo, L Qu, C Zhao, B An, E Wang, R Niu, Y Xin, J Lu, K Han Journal of Alloys and Compounds 662, 355-360, 2016 | 39 | 2016 |
| Strain hardening and softening in nanotwinned Cu R Niu, K Han Scripta Materialia 68 (12), 960-963, 2013 | 36 | 2013 |
| Ultrafine microstructure and hardness in Fe-Cr-Co alloy induced by spinodal decomposition under magnetic field Z Xiang, L Zhang, Y Xin, B An, R Niu, M Mardani, T Siegrist, J Lu, ... Materials & Design 199, 109383, 2021 | 24 | 2021 |
| Improvement of properties in Cu–Ag composites by doping induced microstructural refinement C Zhao, R Niu, Y Xin, D Brown, D McGuire, E Wang, K Han Materials Science and Engineering: A 799, 140091, 2021 | 23 | 2021 |
| Precipitation and dissolution of Ag in ageing hypoeutectic alloys X Zuo, K Han, C Zhao, R Niu, E Wang Journal of Alloys and Compounds 622, 69-72, 2015 | 23 | 2015 |
| Influence of grain boundary characteristics on thermal stability in nanotwinned copper R Niu, K Han, Y Su, T Besara, TM Siegrist, X Zuo Scientific Reports, 31410-13, 2016 | 22 | 2016 |
| Microstructural dependence of magnetoresistance in CuAg alloy solidified with high magnetic field X Zuo, C Zhao, R Niu, E Wang, K Han Journal of Materials Processing Technology 224, 208-212, 2015 | 20 | 2015 |
| Impacts of heat treatment on properties and microstructure of Cu16at% Ag conductors K Han, VJ Toplosky, R Goddard, J Lu, R Niu, J Chen IEEE transactions on applied superconductivity 22 (3), 6900204-6900204, 2011 | 18 | 2011 |
| Hardening Cu-Ag composite by doping with Sc B An, Y Xin, R Niu, J Lu, E Wang, K Han Materials Letters 252, 207-210, 2019 | 17 | 2019 |
| Response of microstructure to annealing in in situ Cu–Nb microcomposite L Deng, B Wang, K Han, R Niu, H Xiang, KT Hartwig, X Yang Journal of materials science 54, 840-850, 2019 | 12 | 2019 |
| High strength conductors and structural materials for high field magnets K Han, R Niu, J Lu, V Toplosky MRS Advances 1 (17), 1233-1239, 2016 | 12 | 2016 |
| Bending behavior of high-strength conductor K Han, R Goddard, R Niu, T Li, DN Nguyen, JR Michel, J Lu, V Pantsyrny IEEE Transactions on Applied Superconductivity 26 (4), 1-4, 2016 | 11 | 2016 |
| Atomic-scale studies on the effect of boundary coherency on stability in twinned Cu RM Niu, K Han, Su, Y-F. and Salters, V.J. Appl. Phys. Lett. 104 (1), 011913, 2014 | 11 | 2014 |
| Alumina particle reinforced Cu matrix conductors K Han, RE Goddard, V Toplosky, R Niu, J Lu, R Walsh IEEE Transactions on Applied Superconductivity 28 (3), 1-5, 2018 | 10 | 2018 |
| Ductility of metal thin films in flexible electronics RM Niu, G Liu, XD Ding, J Sun Science in China Series E: Technological Sciences 51 (11), 1971-1979, 2008 | 10 | 2008 |
| Suppression of discontinuous precipitation and strength improvement by Sc doping in Cu-6 wt% Ag alloys B An, R Niu, Y Xin, WL Starch, Z Xiang, Y Su, RE Goddard, J Lu, ... Journal of Materials Science & Technology 135, 80-96, 2023 | 9 | 2023 |
