| Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay Acta Materialia 126, 540-551, 2017 | 94 | 2017 |
| Nucleation of tin on the Cu6Sn5 layer in electronic interconnections JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay Acta Materialia 123, 404-415, 2017 | 71 | 2017 |
| Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay Intermetallics 91, 50-64, 2017 | 68 | 2017 |
| Nucleation and growth crystallography of Al8Mn5 on B2-Al (Mn, Fe) in AZ91 magnesium alloys G Zeng, JW Xian, CM Gourlay Acta Materialia 153, 364-376, 2018 | 66 | 2018 |
| Nucleation and growth of tin in Pb-free solder joints CM Gourlay, SA Belyakov, ZL Ma, JW Xian Jom 67, 2383-2393, 2015 | 62 | 2015 |
| Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders JW Xian, SA Belyakov, TB Britton, CM Gourlay Journal of Alloys and Compounds 619, 345-355, 2015 | 58 | 2015 |
| In situ imaging of microstructure formation in electronic interconnections MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ... Scientific reports 7 (1), 40010, 2017 | 52 | 2017 |
| Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints SA Belyakov, JW Xian, K Sweatman, T Nishimura, T Akaiwa, CM Gourlay Journal of Alloys and Compounds 701, 321-334, 2017 | 51 | 2017 |
| Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds ZL Ma, JW Xian, SA Belyakov, CM Gourlay Acta Materialia 150, 281-294, 2018 | 45 | 2018 |
| A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne International Journal of Plasticity 155, 103308, 2022 | 38 | 2022 |
| Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ... Intermetallics 102, 34-45, 2018 | 33 | 2018 |
| Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints SA Belyakov, J Xian, G Zeng, K Sweatman, T Nishimura, T Akaiwa, ... Journal of Materials Science: Materials in Electronics 30, 378-390, 2019 | 27 | 2019 |
| Controlling Bulk Cu6Sn5 Nucleation in Sn0. 7Cu/Cu Joints with Al Micro-alloying JW Xian, SA Belyakov, CM Gourlay Journal of Electronic Materials 45 (1), 69, 2016 | 25 | 2016 |
| Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder Y Xu, T Gu, J Xian, F Giuliani, TB Britton, CM Gourlay, FPE Dunne International Journal of Plasticity 137, 102904, 2021 | 23 | 2021 |
| Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys JW Xian, L Peng, G Zeng, D Wang, CM Gourlay Materialia 19, 101192, 2021 | 18 | 2021 |
| Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys Y Cui, JW Xian, A Zois, K Marquardt, H Yasuda, CM Gourlay Acta Materialia 249, 118831, 2023 | 17 | 2023 |
| Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron L Peng, G Zeng, J Xian, CM Gourlay Intermetallics 142, 107465, 2022 | 15 | 2022 |
| Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony SA Belyakov, RJ Coyle, B Arfaei, JW Xian, CM Gourlay Journal of Electronic Materials 50, 825-841, 2021 | 15 | 2021 |
| Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints JW Xian, SA Belyakov, CM Gourlay Journal of Electronic Materials 50, 786-795, 2021 | 13 | 2021 |
| The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints ZQ Li, SA Belyakov, JW Xian, CM Gourlay Journal of Electronic Materials 47, 84-95, 2018 | 13 | 2018 |
Christopher M. GourlayDepartment of Materials, Imperial College LondonVerified email at imperial.ac.uk
