Cher Ming Tan
Cher Ming Tan
Professor of Electronics Department, Chang Gung University
Verified email at - Homepage
TitleCited byYear
Electromigration in ULSI interconnects
CM Tan, A Roy
Materials Science and Engineering: R: Reports 58 (1-2), 1-75, 2007
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc
ZH Gan, GQ Yu, BK Tay, CM Tan, ZW Zhao, YQ Fu
Journal of Physics D: Applied Physics 37 (1), 81, 2003
Effect of temperature on the aging rate of Li ion battery operating above room temperature
F Leng, CM Tan, M Pecht
Scientific reports 5, 12967, 2015
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy
S Liu, AK Ng, R Xu, J Wei, CM Tan, Y Yang, Y Chen
Nanoscale 2 (12), 2744-2750, 2010
Electrowetting control of Cassie-to-Wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites
Z Han, B Tay, C Tan, M Shakerzadeh, K Ostrikov
ACS nano 3 (10), 3031-3036, 2009
Aligned carbon nanotubes for through-wafer interconnects
T Xu, Z Wang, J Miao, X Chen, CM Tan
Applied Physics Letters 91 (4), 042108, 2007
Size, temperature, and bond nature dependence of elasticity and its derivatives on extensibility, Debye temperature, and heat capacity of nanostructures
MX Gu, CQ Sun, Z Chen, TCA Yeung, S Li, CM Tan, V Nosik
Physical Review B 75 (12), 125403, 2007
A framework to practical predictive maintenance modeling for multi-state systems
CM Tan, N Raghavan
Reliability Engineering & System Safety 93 (8), 1138-1150, 2008
Electromigration performance of Through Silicon Via (TSV)–A modeling approach
YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu
Microelectronics Reliability 50 (9-11), 1336-1340, 2010
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling
MD Le, CM Tan
Reliability Engineering & System Safety 113, 21-29, 2013
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Intermetallics 31, 72-78, 2012
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
CM Tan, A Roy
Thin Solid Films 504 (1-2), 288-293, 2006
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
YD Han, SML Nai, HY Jing, LY Xu, CM Tan, J Wei
Journal of Materials Science: Materials in Electronics 22 (3), 315-322, 2011
Revisit to the finite element modeling of electromigration for narrow interconnects
CM Tan, Y Hou, W Li
Journal of applied physics 102 (3), 033705, 2007
Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Journal of Electronic Materials 39 (2), 223-229, 2010
Simulated annealing
FS Wang, LH Chen
Encyclopedia of Systems Biology, 1942-1942, 2013
Analysis of humidity effects on the degradation of high-power white LEDs
CM Tan, BKE Chen, G Xu, Y Liu
Microelectronics Reliability 49 (9-11), 1226-1230, 2009
Using power diode models for circuit simulations-a comprehensive review
CM Tan, KJ Tseng
IEEE Transactions on Industrial Electronics 46 (3), 637-645, 1999
Time evolution degradation physics in high power white LEDs under high temperature-humidity conditions
CM Tan, P Singh
IEEE Transactions on Device and Materials Reliability 14 (2), 742-750, 2014
Current crowding effect on copper dual damascene via bottom failure for ULSI applications
CM Tan, A Roy, AV Vairagar, A Krishnamoorthy, SG Mhaisalkar
IEEE Transactions on Device and Materials Reliability 5 (2), 198-205, 2005
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