| Fluorescent imaging of single nanoparticles and viruses on a smart phone Q Wei, H Qi, W Luo, D Tseng, SJ Ki, Z Wan, Z Göröcs, LA Bentolila, ... ACS nano 7 (10), 9147-9155, 2013 | 500 | 2013 |
| On-chip cytometry using plasmonic nanoparticle enhanced lensfree holography Q Wei, E McLeod, H Qi, Z Wan, R Sun, A Ozcan Scientific reports 3 (1), 1699, 2013 | 88 | 2013 |
| Charge-trap transistors for CMOS-only analog memory X Gu, Z Wan, SS Iyer IEEE Transactions on Electron Devices 66 (10), 4183-4187, 2019 | 32 | 2019 |
| “FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017 | 31 | 2017 |
| Process development of power delivery through wafer vias for silicon interconnect fabric MH Liu, B Vaisband, A Hanna, Y Luo, Z Wan, SS Iyer 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 579-586, 2019 | 19 | 2019 |
| Toward human-scale brain computing using 3D wafer scale integration A Kumar, Z Wan, WW Wilcke, SS Iyer ACM Journal on Emerging Technologies in Computing Systems (JETC) 13 (3), 1-21, 2017 | 17 | 2017 |
| A 12nm 137 TOPS/W Digital Compute-In-Memory using Foundry 8T SRAM Bitcell supporting 16 Kernel Weight Sets for AI Edge Applications G Jedhe, C Deshpande, S Kumar, CX Xue, Z Guo, R Garg, KS Jway, ... 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2023 | 11 | 2023 |
| Accuracy and resiliency of analog compute-in-memory inference engines Z Wan, T Wang, Y Zhou, SS Iyer, VP Roychowdhury ACM Journal on Emerging Technologies in Computing Systems (JETC) 18 (2), 1-23, 2022 | 8 | 2022 |
| Low-temperature wafer bonding for three-dimensional wafer-scale integration Z Wan, K Winstel, A Kumar, SS Iyer 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2018 | 6 | 2018 |
| Fluorescent imaging of single nanoparticles and viruses on a smart phone. ACS Nano 7 (10): 9147–9155 Q Wei, H Qi, W Luo, D Tseng, SJ Ki, Z Wan, Z Göröcs, LA Bentolila, TT Wu, ... Epub 2013/09/11, 2013 | 6 | 2013 |
| Three-dimensional wafer scale integration for ultra-large-scale cognitive systems Z Wan, SS Iyer 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017 | 5 | 2017 |
| Fluorescent imaging of single nanoparticles and viruses on a smart phone. ACS Nano 7: 9147–9155 Q Wei, H Qi, W Luo, D Tseng, SJ Ki, Z Wan, Z Göröcs, LA Bentolila, TT Wu, ... | 5 | 2013 |
| 20.1 NVE: A 3nm 23.2 TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices ME Shih, SW Hsieh, PY Tsai, MH Lin, PK Tsung, EJ Chang, J Liang, ... 2024 IEEE International Solid-State Circuits Conference (ISSCC) 67, 360-362, 2024 | 4 | 2024 |
| Scalable and analog neuromorphic computing systems Z Wan University of California, Los Angeles, 2020 | 4 | 2020 |
| Lensfree holographic cytometry using plasmonic nanoparticles Q Wei, E McLeod, H Qi, Z Wan, R Sun, A Ozcan 2013 IEEE Photonics Conference, 3-4, 2013 | 3 | 2013 |
| Three-dimensional wafer scale integration for ultra-large-scale neuromorphic systems Z Wan University of California, Los Angeles, 2017 | 1 | 2017 |
| Neural network system with neurons including charge-trap transistors and neural integrators and methods therefor SL Moran, SS Iyer, Z Wan, S Pamarti US Patent App. 18/255,346, 2024 | | 2024 |
| Fine-Pitch Integration Technology for Cognitive System Scaling Z Wan, S Iyer | | 2018 |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Verified email at g.ucla.edu
