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Jacob Brenneman
Jacob Brenneman
Graduate Student, Carnegie Mellon University
Verified email at andrew.cmu.edu
Title
Cited by
Cited by
Year
3D printed three-dimensional metallic microlattices with controlled and tunable mechanical properties
MS Saleh, C Hu, J Brenneman, R Panat
Additive Manufacturing 39, 101856, 2021
232021
Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects
J Brenneman, DZ Tansel, GK Fedder, R Panat
Extreme Mechanics Letters 43, 101199, 2021
222021
Mechanical characterization of polydimethylsiloxane (PDMS) exposed to thermal histories up to 300° C in a vacuum environment
DZ Tansel, J Brenneman, GK Fedder, R Panat
Journal of Micromechanics and Microengineering 30 (6), 067001, 2020
142020
High‐Conductivity Crack‐Free 3D Electrical Interconnects Directly Printed on Soft PDMS Substrates
J Brenneman, DZ Tansel, GK Fedder, R Panat
Advanced Materials Technologies 7 (12), 2200396, 2022
82022
Novel systems for increasing efficiency and power output of in-conduit hydroelectric power system and turbine
MR Cosby, TP Braun, RA Schlabach, I Palley, JJ Brenneman, JT Thomas
US Patent App. 13/353,317, 2012
52012
In-conduit turbines and hydroelectric power systems
RA Schlabach, MR Cosby, E Kurth, I Palley, G Smith, JJ Brenneman
US Patent App. 13/461,778, 2013
42013
A Semiempirical Model for Post‐Yield Stress Instability in the Stress–Strain Response of 3D Lattice Structures under Compressive Loads
J Brenneman, M Lovalekar, R Panat
Advanced Engineering Materials 25 (12), 2201428, 2023
12023
A Semiempirical Model for Post‐Yield Stress Instability in the Stress–Strain Response of 3D Lattice Structures under Compressive Loads
J Brenneman, M Lovalekar, R Panat
Advanced Engineering Materials 25 (12), 2201428, 2023
12023
Aerosol-Jet-Printed Stretchable Electronic Decal Technology
DZ Tansel, J Brenneman, R Panat, GK Fedder
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems …, 2022
12022
3D Printed Stretchable Electronics: Fabrication Using Aerosol Jet, Fundamental Mechanics, and Applications
J Brenneman
Carnegie Mellon University, 2022
12022
Stretchable 3D Printed Circuits
GK Fedder, R Panat, J Brenneman, D Tansel
US Patent App. 18/539,899, 2024
2024
Stretchable 3D-printed circuit boards
GK Fedder, R Panat, J Brenneman, DZ Tansel
US Patent 11,856,708, 2023
2023
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