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Husam  Alissa
Husam Alissa
Director - Systems Technology
Verified email at microsoft.com - Homepage
Title
Cited by
Cited by
Year
Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime
MS Husam A Alissa, Kourosh Nemati, Bahgat Sammakia, Ken Schneebli, Roger Schmidt
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016
472016
An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions
MI Tradat, BG Sammakia, CH Hoang, HA Alissa
Applied Energy 289, 116663, 2021
442021
Cost-Efficient Overclocking in Immersion-Cooled Datacenters
M Jalili, I Manousakis, Í Goiri, PA Misra, A Raniwala, H Alissa, ...
ISCA: International Symposium on Computer Architecture, 2021
422021
Control systems and prediction methods for it cooling performance in containment
H Alissa, B Sammakia, K Nemati, K Ghose
US Patent 11,076,509, 2021
412021
Innovative Approaches of Experimentally Guided CFD Modeling for Data Centers
HA Alissa, K Nemati, B Sammakia, K Ghose, M Seymour, R Schmidt
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st, 2015
392015
Experimental And Numerical Characterization Of A Raised Floor Data Center Using Rapid Operational Flow Curves Model
HA Alissa, K Nemati, B Sammakia, M Seymour, K Schneebli, R Schmidt
Proceedings of the ASME 2015 International Technical Conference and …, 2015
362015
Chip to chiller experimental cooling failure analysis of data centers: The interaction between IT and facility
HA Alissa, K Nemati, BG Sammakia, MJ Seymour, R Tipton, D Mendo, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (9 …, 2016
332016
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling
B Ramakrishnan, H Alissa, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021
322021
Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics
YMAMARGMITGSHA Alissab
International Journal of Heat and Mass Transfer, 2021
30*2021
Control systems and prediction methods for it cooling performance in containment
H Alissa, K Nemati, B Sammakia, K Ghose
US Patent App. 17/384,733, 2021
282021
Steady-state and transient comparison of cold and hot aisle containment and chimney
K Nemati, HA Alissa, BT Murray, B Sammakia
2016 15th IEEE intersociety conference on thermal and thermomechanical …, 2016
282016
Performance of temperature controlled perimeter and row-based cooling systems in open and containment environment
K Nemati, H Alissa, B Sammakia
ASME International Mechanical Engineering Congress and Exposition 57502 …, 2015
272015
Experimentally validated numerical model of a fully-enclosed hybrid cooled server cabinet
K Nemati, HA Alissa, BT Murray, B Sammakia, M Seymour
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
272015
Impact of elevated temperature on data center operation based on internal and external IT instrumentation
MI Tradat, HA Alissa, K Nemati, S Khalili, BG Sammakia, MJ Seymour, ...
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017
182017
Analysis of airflow imbalances in an open compute high density storage data center
HA Alissa, K Nemati, ULN Puvvadi, BG Sammakia, K Schneebeli, ...
Applied Thermal Engineering 108, 937-950, 2016
182016
Self-contained immersion cooling server assemblies
Keehn, L Nicholas, A Robert Jason, Husam
US Patent 10,925,188, 2021
162021
Numerical investigation of underfloor obstructions in open-contained data center with fan curves
H Alissa, S Alkharabsheh, S Bhopte, B Sammakia
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
162014
Experimental characterization of a Rear Door Heat exchanger with localized containment
K Nemati, HA Alissa, U Puvvadi, BT Murray, B Sammakia, K Ghose
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
152016
Immersion cooling enclosures with insulating liners
HA Nicholas Keehn, Eric Clarence Peterson, Winston Saunders
US Patent 10,765,033, 2020
14*2020
Immersion Cooling Infrastructure Module Having Compute Device Form Factor
H Alissa, N Keehn
US Patent 10,750,637, 2020
142020
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