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Xuefeng WangTsinghua UniversityVerified email at mails.tsinghua.edu.cn
Wentian MiUC BerkeleyVerified email at berkeley.edu
Han WangUniversity of Hong KongVerified email at hku.hk
Qianyi XieApplied Materials Inc.Verified email at amat.com
Ya-Long CuiPh.D. Candidate of Microelectronics, Tsinghua UniversityVerified email at mails.tsinghua.edu.cn
Yufeng WangElectrical Engineering, University of Southern CaliforniaVerified email at usc.edu
Fengnian XiaProfessor of Electrical Engineering, Yale UniversityVerified email at yale.edu
Hongwei ZhuTsinghua UniversityVerified email at tsinghua.edu.cn
Qiushi GuoAssistant Professor, CUNY Advanced Science Research CenterVerified email at gc.cuny.edu
Yuxuan Cosmi LinTexas A&M UniversityVerified email at tamu.edu
Hong-Yu (Henry) ChenGigaDevice Semiconductor Inc.Verified email at gigadevice.com
H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
Huan ZhaoWigner Distinguished Staff Fellow, Oak Ridge National LaboratoryVerified email at ornl.gov
judy j. chaProfessor, Materials Science and Engineering, Cornell UniversityVerified email at cornell.edu
Xiaomu WangSchool of Electronic Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
Yuegang ZhangSuzhou Institute of Nano-Tech and Nano-BionicsVerified email at tsinghua.edu.cn
Po-Wen ChiuDepartment of Electrical Engineering, Nation Tsing Hua UniversityVerified email at ee.nthu.edu.tw
Xinming LiTHU, MIT, NCNST, CUHK, PolyU, NIMS, South China Normal UniverstiyVerified email at m.scnu.edu.cn
Hao RenArizona State University and Shanghaitech UniversityVerified email at asu.edu
Junseok ChaeAssociate Dean for Research, Professor of Electrical Computer and Energy Engineering, Arizona StateVerified email at asu.edu