Kyoung-sik Moon
Cited by
Cited by
Electronics without lead
YI Li, K Moon, CP Wong
Science 308 (5727), 1419-1420, 2005
Thermal behavior of silver nanoparticles for low-temperature interconnect applications
KS Moon, H Dong, R Maric, S Pothukuchi, A Hunt, Y Li, CP Wong
Journal of electronic materials 34 (2), 168-175, 2005
Glass transition and relaxation behavior of epoxy nanocomposites
Y Sun, Z Zhang, KS Moon, CP Wong
Journal of Polymer Science Part B: Polymer Physics 42 (21), 3849-3858, 2004
Superior capacitance of functionalized graphene
Z Lin, Y Liu, Y Yao, OJ Hildreth, Z Li, K Moon, C Wong
The Journal of Physical Chemistry C 115 (14), 7120-7125, 2011
Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites
H Jiang, K Moon, Y Li, CP Wong
Chemistry of Materials 18 (13), 2969-2973, 2006
Large-scale production of two-dimensional nanosheets
Y Yao, Z Lin, Z Li, X Song, KS Moon, C Wong
Journal of Materials Chemistry 22 (27), 13494-13499, 2012
Synthesis and dielectric properties of novel high-K polymer composites containing in-situ formed silver nanoparticles for embedded capacitor applications
J Lu, KS Moon, J Xu, CP Wong
Journal of Materials Chemistry 16 (16), 1543-1548, 2006
Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation
Z Lin, Y Liu, S Raghavan, K Moon, SK Sitaraman, C Wong
ACS applied materials & interfaces 5 (15), 7633-7640, 2013
High dielectric constant polyaniline/epoxy composites via in situ polymerization for embedded capacitor applications
J Lu, KS Moon, BK Kim, CP Wong
Polymer 48 (6), 1510-1516, 2007
Thermo-mechanical characterization of metal/polymer composite filaments and printing parameter study for fused deposition modeling in the 3D printing process
S Hwang, EI Reyes, K Moon, RC Rumpf, NS Kim
Journal of Electronic Materials 44 (3), 771-777, 2015
Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation
Z Lin, A Mcnamara, Y Liu, K Moon, CP Wong
Composites Science and Technology 90, 123-128, 2014
Size-dependent melting properties of tin nanoparticles
H Jiang, K Moon, H Dong, F Hua, CP Wong
Chemical Physics Letters 429 (4-6), 492-496, 2006
Micro-sized silicon–carbon composites composed of carbon-coated sub-10 nm Si primary particles as high-performance anode materials for lithium-ion batteries
J Song, S Chen, M Zhou, T Xu, D Lv, ML Gordin, T Long, M Melnyk, ...
Journal of Materials Chemistry A 2 (5), 1257-1262, 2014
A combined process of in situ functionalization and microwave treatment to achieve ultrasmall thermal expansion of aligned carbon nanotube–polymer nanocomposites: toward …
W Lin, KS Moon, CP Wong
Advanced Materials 21 (23), 2421-2424, 2009
Vertically aligned and interconnected graphene networks for high thermal conductivity of epoxy composites with ultralow loading
G Lian, CC Tuan, L Li, S Jiao, Q Wang, KS Moon, D Cui, CP Wong
Chemistry of Materials 28 (17), 6096-6104, 2016
Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles
R Zhang, K Moon, W Lin, CP Wong
Journal of Materials Chemistry 20 (10), 2018-2023, 2010
Wafer bonding using microwave heating of parylene intermediate layers
H Noh, K Moon, A Cannon, PJ Hesketh, CP Wong
Journal of micromechanics and microengineering 14 (4), 625, 2004
Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
H Jiang, KS Moon, J Lu, CP Wong
Journal of electronic materials 34 (11), 1432-1439, 2005
Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders
H Jiang, K Moon, F Hua, CP Wong
Chemistry of Materials 19 (18), 4482-4485, 2007
Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics
Z Li, R Zhang, KS Moon, Y Liu, K Hansen, T Le, CP Wong
Advanced Functional Materials 23 (11), 1459-1465, 2013
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