Compact lumped element model for TSV in 3D-ICs K Salah, A El Rouby, H Ragai, K Amin, Y Ismail 2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2321-2324, 2011 | 27 | 2011 |
Compact TSV modeling for low power application K Salah, A El-Rouby, Y Ismail, H Ragai, K Amin 2010 International Conference on Energy Aware Computing, 1-2, 2010 | 7 | 2010 |