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SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Verified email at g.ucla.edu
Arsalan AlamUniversity of California, Los AngelesVerified email at g.ucla.edu
Amir HannaSemiconductor Process Development/ R&D Engineer at Keysight TechnologiesVerified email at keysight.com
Randall IrwinUniversity of California, Los AngelesVerified email at ucla.edu
Takafumi FukushimaAssociate Procfessor, Tohoku UniversityVerified email at lbc.mech.tohoku.ac.jp
Steve CroninUniversity of Southern CaliforniaVerified email at usc.edu
Zhen LiUniversity of Southern CaliforniaVerified email at usc.edu
Ioannis ChatzakisTexas Tech UniversityVerified email at ttu.edu
Rohan DhallLawrence Berkeley LabVerified email at lbl.gov
SivaChandra JangamUCLA, AppleVerified email at g.ucla.edu
SAPTADEEP PALEtched, UCLAVerified email at ucla.edu
Adeel BajwaKulicke & Soffa Industries Inc.Verified email at kns.com
Ajit ParanjpeManaging Member, Prima Innotech LLCVerified email at prodigy.net
Chun-Chung ChenUniversity of Southern CaliforniaVerified email at usc.edu
GUANGQI OUYANGPh.D. Candidate, University of California, Los AngelesVerified email at g.ucla.edu
Zhe WanUCLA, MediatekVerified email at ucla.edu
Steven MoranGraduate Student Researcher, Center for Heterogeneous Integration and Performance Scaling, UCLAVerified email at g.ucla.edu
Henry SunPhD Student, UCLAVerified email at ucla.edu
Chee Wei WongUniversity of California, Los AngelesVerified email at ucla.edu
Timothy S FisherMechanical & Aerospace Engineering, University of California Los AngelesVerified email at g.ucla.edu