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Goutham Ezhilarasu
Goutham Ezhilarasu
R&D Engineer, CHIPS, UCLA; Past: IIT-Madras
Verified email at g.ucla.edu - Homepage
Title
Cited by
Cited by
Year
Indirect Band Gap Emission by Hot Electron Injection in Metal/MoS2 and Metal/WSe2 Heterojunctions
Z Li, G Ezhilarasu, I Chatzakis, R Dhall, CC Chen, SB Cronin
Nano letters 15 (6), 3977-3982, 2015
712015
“FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017
312017
Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based …
A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018
272018
A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging
G Ezhilarasu, A Hanna, R Irwin, A Alam, SS Iyer
2018 IEEE International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2018
232018
Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate
A Alam, A Hanna, R Irwin, G Ezhilarasu, H Boo, Y Hu, CW Wong, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 277-282, 2019
172019
A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™
A Alam, M Molter, B Gaonkar, A Hanna, R Irwin, S Benedict, G Ezhilarasu, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 985-990, 2020
142020
High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing
G Ezhilarasu, A Hanna, A Paranjpe, SS Iyer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1470-1474, 2019
122019
A heterogeneously integrated, high resolution and flexible inorganic μLED display using fan-out wafer-level packaging
G Ezhilarasu, A Paranjpe, J Lee, F Wei, SS Iyer
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 677-684, 2020
92020
A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils
G Ouyang, G Ezhilarasu, H Sun, H Ren, YT Yang, SS Iyer
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271, 2021
62021
Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane
G Ouyang, A Hanna, S Benedict, G Ezhilarasu, A Alam, RW Irwin, SS Iyer
IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022
32022
A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging
H Sun, G Ezhilarasu, G Ouyang, R Irwin, SS Iyer
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1390-1394, 2022
32022
Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors
S Benedict, A Nagarajan, K Thejas, A Alam, MS Illango, G Ezhilarasu, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 824-828, 2020
22020
FlexTrate A Biocompatible Flexible Electronics Platform for High Performance Applications using Fan-Out Wafer-level Packaging
A Hanna, A Alam, G Ezhilarasu, T Fukushima, SS Iyer
University of California Los Angeles Los Angeles United States, 2019
22019
Flexible, Heterogeneously Integrated microLED Displays in Elastomeric Substrates Using Fan-Out Wafer-Level Packaging
G Ezhilarasu
University of California, Los Angeles, 2021
12021
A Robust and Low-cost Fiber-optic Array Attachment Solution for Silicon Photonics Chips with Large Number of Input/output Channels
A Gayen, N Nallusamy, G Ezhilarasu, S Hassan, S Vinoth, K Piyush, ...
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2024
2024
Integrated Micro-Capacitors & Micro-Inductors for Next Generation Electronics
G Ezhilarasu, SS Iyer
IEEE Nanotechnology Magazine, 2024
2024
System and Methodology for Attaching Fiber Array Modules to Photonic Chips
A Gayen, N Nallusamy, G Ezhilarasu, S Hassan, S Vinoth, K Piyush, ...
IN Patent App. Provisional Patent (IDF #2757), 2024
2024
Flexible inorganic microled display device and method of manufacturing thereof
SS Iyer, G Ezhilarasu
US Patent App. 18/007,697, 2023
2023
Adhesive bonding for flexible microLED display assembly
G Ezhilarasu, S Iyer, A Paranjpe, J Lee, F Wei
Chip Scale Review, 54-56, 2021
2021
Fine Pitch (40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging
A Hanna, A Alam, G Ezhilarasu, SS Iyer
International Symposium on Microelectronics 2018 (1), 000064-000068, 2018
2018
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Articles 1–20