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SAPTADEEP PAL
SAPTADEEP PAL
Electrical and Computer Engineering, University of California Los Angeles
Verified email at ucla.edu
Title
Cited by
Cited by
Year
Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding
AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ...
2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017
982017
Optimizing multi-GPU parallelization strategies for deep learning training
S Pal, E Ebrahimi, A Zulfiqar, Y Fu, V Zhang, S Migacz, D Nellans, ...
Ieee Micro 39 (5), 91-101, 2019
572019
Latency, bandwidth and power benefits of the superchips integration scheme
SC Jangam, S Pal, A Bajwa, S Pamarti, P Gupta, SS Iyer
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 86-94, 2017
532017
Architecting waferscale processors-a GPU case study
S Pal, D Petrisko, M Tomei, P Gupta, SS Iyer, R Kumar
2019 IEEE International Symposium on High Performance Computer Architecture …, 2019
432019
A case for packageless processors
S Pal, D Petrisko, AA Bajwa, P Gupta, SS Iyer, R Kumar
2018 IEEE international symposium on high performance computer architecture …, 2018
302018
Design space exploration for chiplet-assembly-based processors
S Pal, D Petrisko, R Kumar, P Gupta
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (4 …, 2020
262020
Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based …
A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018
262018
“FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017
262017
Demonstration of a heterogeneously integrated system-on-wafer (SoW) assembly
AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018
222018
Hybrid VC-MTJ/CMOS non-volatile stochastic logic for efficient computing
S Wang, S Pal, T Li, A Pan, C Grezes, P Khalili-Amiri, KL Wang, P Gupta
2017 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2017
212017
Designing a 2048-chiplet, 14336-core waferscale processor
S Pal, J Liu, I Alam, N Cebry, H Suhail, S Bu, SS Iyer, S Pamarti, R Kumar, ...
2021 58th ACM/IEEE Design Automation Conference (DAC), 1183-1188, 2021
182021
Cable length minimisation in long-reach-PON planning for sparsely populated areas
S Pal, C Zukowski, A Nag, DB Payne, M Ruffini
2014 International Conference on Optical Network Design and Modeling, 234-239, 2014
102014
FPGA implementation of stream cipher using Toeplitz Hash function
S Pal, KKS Pandian, KC Ray
2014 International Conference on Advances in Computing, Communications and …, 2014
92014
Compression with multi-ECC: Enhanced error resiliency for magnetic memories
I Alam, S Pal, P Gupta
Proceedings of the International Symposium on Memory Systems, 85-100, 2019
62019
I/o architecture, substrate design, and bonding process for a heterogeneous dielet-assembly based waferscale processor
S Pal, I Alam, K Sahoo, H Suhail, R Kumar, S Pamarti, P Gupta, SS Iyer
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 298-303, 2021
42021
Flexible connectors and PCB segmentation for signaling and power delivery in wafer-scale systems
R Irwin, K Sahoo, S Pal, SS Iyer
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 507-513, 2021
42021
Pathfinding for 2.5 D interconnect technologies
S Pal, P Gupta
Proceedings of the Workshop on System-Level Interconnect: Problems and …, 2020
42020
Chiplets: How Small is too Small?
A Graening, S Pal, P Gupta
2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023
32023
Copper to gold thermal compression bonding in heterogenous wafer-scale systems
K Sahoo, S Pal, N Shakoorzadeh, YT Yang, SS Iyer
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 487-493, 2021
32021
Scale-Out Packageless Processing
S Pal
University of California, Los Angeles, 2021
32021
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