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Babak FallahazadSoC Device Engineer, IntelVerified email at intel.com
Seyoung KimPOSTECH, South KoreaVerified email at postech.ac.kr
Junghyo NahProfessor, Dept. of Electrical Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
Kyounghwan KimAppleVerified email at utexas.edu
Luigi ColomboUT DallasVerified email at utdallas.edu
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
Stefano LarentisFA Engineer @ NXP SemiconductorsVerified email at utexas.edu
A.H. MacDonaldUniversity of Texas Austin, Indiana University, NRC Canada, U of TorontoVerified email at physics.utexas.edu
Leonard F. RegisterProfessor of Electrical and Computer EngineeringVerified email at austin.utexas.edu
Kayoung LeeKAISTVerified email at kaist.ac.kr
Rodney RuoffThe IBS CMCM, Dept of Chemistry, School of Energy and ChEng, School of MS&EVerified email at unist.ac.kr
Davood ShahrjerdiNew York UniversityVerified email at nyu.edu
Amritesh RaiMicron Technology, Inc.Verified email at utexas.edu
David C DillenUniversity of Texas at AustinVerified email at utexas.edu
Sangwoo KangTexas Instruments Inc.Verified email at ti.com
Y.P. ShkolnikovExponent, IncVerified email at alumni.princeton.edu
Sorin MelinteProfessor, ICTEAM, EPL, Université catholique de LouvainVerified email at uclouvain.be
G William BurgPhD Student, University of Texas at AustinVerified email at utexas.edu
Supratik GuhaUniversity of Chicago and Argonne National LaboratoryVerified email at uchicago.edu
En-Shao LiuUniversity of Texas at AustinVerified email at mail.utexas.edu

Emanuel Tutuc
Professor, The University of Texas at Austin
Verified email at mer.utexas.edu - Homepage