| Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation Z Lin, Y Liu, S Raghavan, K Moon, SK Sitaraman, C Wong ACS applied materials & interfaces 5 (15), 7633-7640, 2013 | 463 | 2013 |
| Experiments for obtaining cohesive-zone parameters for copper-mold compound interfacial delamination WER Krieger, S Raghavan, SK Sitaraman IEEE Transactions on components, packaging and manufacturing technology 6 (9 …, 2016 | 32 | 2016 |
| Study of chip–package interaction parameters on interlayer dielectric crack propagation S Raghavan, I Schmadlak, G Leal, SK Sitaraman IEEE Transactions on Device and Materials Reliability 14 (1), 57-65, 2013 | 32 | 2013 |
| Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability S Raghavan, I Schmadlak, G Leal, SK Sitaraman Engineering Fracture Mechanics 153, 259-277, 2016 | 29 | 2016 |
| Interlayer dielectric cracking in back end of line (BEOL) stack S Raghavan, I Schmadlak, SK Sitaraman 2012 IEEE 62nd Electronic Components and Technology Conference, 1467-1474, 2012 | 24 | 2012 |
| Methodology to predict substrate warpage and different techniques to achieve substrate warpage targets S Raghavan, K Klein, S Yoon, JD Kim, KS Moon, CP Wong, SK Sitaraman IEEE Transactions on components, packaging and manufacturing technology 1 (7 …, 2011 | 17 | 2011 |
| Cohesive zone experiments for copper/mold compound delamination WER Krieger, S Raghavan, A Kwatra, SK Sitaraman 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 983-989, 2014 | 14 | 2014 |
| Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability S Raghavan, SK Sitaraman Engineering Fracture Mechanics 178, 1-13, 2017 | 11 | 2017 |
| Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests S Raghavan, I Schmadlak, G Leal, SK Sitaraman 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 11 | 2014 |
| Experimental and theoretical study of on-chip backend-of-line (BEOL) stack fracture during flip-chip reflow assembly (Doctoral dissertation, Georgia Institute of Technology) S Raghavan | 5 | 2014 |
| Experimental and theoretical study of on-chip back-end-of-line (BEOL) stack fracture during flip-chip reflow assembly S Raghavan Georgia Institute of Technology, 2014 | 3 | 2014 |
| Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies S Raghavan, I Schmadlak, G Leal, SK Sitaraman ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 2 | 2014 |
| Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability S Raghavan, I Schmadlak, G Leal, S Sitaraman ASME International Mechanical Engineering Congress and Exposition 56390 …, 2013 | 2 | 2013 |
| An Efficient Implementation of Polymer Viscoelastic Behavior Through a Pseudo Viscoelastic Model S Raghavan, RI Okereke, SK Sitaraman Journal of microelectronics and electronic packaging 8 (2), 83-87, 2011 | 2 | 2011 |
