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- Masataka HigashiwakiOsaka Metropolitan University | National Institute of Information and Communications TechnologyVerified email at omu.ac.jp
- Umesh MishraUCSBVerified email at ece.ucsb.edu
- Jim SpeckProfessor of Materials, UCSBVerified email at ucsb.edu
- Stacia KellerUniversity of California Santa BarbaraVerified email at ece.ucsb.edu
- Uttam SingisettiProfessor, Electrical Engineering, Univeristy at Buffalo (SUNY)Verified email at buffalo.edu
- Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu
- Steven DenBaarsProfessor of Materials, University of California Santa BarbaraVerified email at engineering.ucsb.edu
- David BrownBAE SystemsVerified email at baesystems.com
- Stephen W. KaunApeel SciencesVerified email at apeelsciences.com
- Keita KonishiNovel Crystal technology, Inc.Verified email at novelcrystal.co.jp
- George MalliarasPrince Philip Professor of Technology at University of CambridgeVerified email at cam.ac.uk
- Sansaptak DasguptaHardware Engineer, AppleVerified email at apple.com
- Richard HillManager - MicronVerified email at micron.com
- Tomás PalaciosMITVerified email at mit.edu
- Alessandro ChiniProfessor of Electronics, University of Modena and Reggio Emilia, ItalyVerified email at unimore.it
- Jing LuUniversity of California, Santa BarbaraVerified email at ece.ucsb.edu
- Rongming ChuThe Pennsylvania State UniversityVerified email at psu.edu
- Srabanti ChowdhuryStanford UniversityVerified email at stanford.edu
- Aaron ArehartAssistant Research Professor of Electrical and Computer Engineering, The Ohio State UniversityVerified email at osu.edu
- Steven RingelThe Ohio State UniversityVerified email at osu.edu
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Man Hoi Wong
Associate Professor, ECE, Hong Kong University of Science and Technology
Verified email at ust.hk