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Co-authors
Satyajit MojumderNorthwestern University, Bangladesh University of Engineering and Technology (BUET)Verified email at u.northwestern.edu- Tawfiqur RakibPost-doctoral researcher, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Dr. Mohammad MotalabProfessor of Mechanical Engineering, Bangladesh University of Engineering and TechnologyVerified email at me.buet.ac.bd
- Alok SutradharAssistant Professor, Mechanical and Aerospace Engineering, The Ohio State UniversityVerified email at osu.edu
- Md Mahbubul IslamAssistant Professor of Mechanical Engineering, Wayne State UniversityVerified email at wayne.edu
- Khan Rabbi, Ph.D.Packaging R&D Engineer (Thermal Fluids) at Intel CorporationVerified email at intel.com
- Sourav Saha (সৌরভ সাহা)Northwestern University, Bangladesh University of Engineering and TechnologyVerified email at u.northwestern.edu
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Sourav Das
Purdue University, The Ohio State University, Bangladesh University of Engineering and Technology
Verified email at purdue.edu - Homepage