| Multiscale simulation approach on sub-10 nm extreme ultraviolet photoresist patterning: Insights from nanoscale heterogeneity of polymer M Kim, J Moon, J Choi, S Park, B Lee*, M Cho* Macromolecules 51 (17), 6922-6935, 2018 | 29 | 2018 |
| Multiscale simulation of extreme ultraviolet nanolithography: impact of acid–base reaction on pattern roughness H Lee†, S Park†, M Kim, J Moon, B Lee, M Cho* Journal of Materials Chemistry C 9 (4), 1183-1195, 2021 | 23 | 2021 |
| Tailoring Polymorphic Heterostructures of MoS2–WS2 (1T/1T, 2H/2H) for Efficient Hydrogen Evolution Reaction H Seok, M Kim, J Cho, E Kim, S Son, KW Kim, JK Kim, PJ Yoo, M Kim, ... ACS Sustainable Chemistry & Engineering 11 (2), 568-577, 2023 | 13 | 2023 |
| Light penetration-coupled photoisomerization modeling for photodeformation of diarylethene single crystal: upscaling isomerization to macroscopic deformation M Kim, JH Yun, M Cho* Scientific Reports 7 (1), 1-13, 2017 | 13 | 2017 |
| Selective dissolution resistance control of EUV photoresist using multiscale simulation: rational design of hybrid system M Kim†, J Moon†, S Park, M Cho* Macromolecules 53 (12), 4748-4763, 2020 | 11 | 2020 |
| Tailoring polymer microstructure for the mitigation of the pattern collapse in sub-10 nm EUV lithography: Multiscale simulation study M Kim, S Park, J Choi, J Moon, M Cho* Applied Surface Science 536, 147514, 2021 | 10 | 2021 |
| Engineering Silk Protein to Modulate Polymorphic Transitions for Green Lithography Resists SC Chung, JS Park, RK Jha, J Kim, J Kim, M Kim, J Choi, H Kim, DH Park, ... ACS Applied Materials & Interfaces 14 (51), 56623-56634, 2022 | 6 | 2022 |
| Theoretical modeling of PEB procedure on EUV resist using FDM formulation M Kim, J Moon, J Choi, B Lee, C Jeong, H Kim, M Cho* Extreme Ultraviolet (EUV) Lithography IX 10583, 487-492, 2018 | 5 | 2018 |
| Multiscale simulations for exploring photo-chemical processes to mitigate the critical dimension variability of contact holes in EUV lithography S Park†, H Lee†, M Kim, T Kim, B Lee, M Cho* Journal of Materials Chemistry C 9 (26), 8189-8203, 2021 | 4 | 2021 |
| MOCVD of Hierarchical C‐MoS2 Nanobranches for ppt‐Level NO2 Detection J Song†, J Baek†, J Cho, T Kim, M Kim, HS Kim*, J Mun*, SW Kang* Small Structures, 2200392, 2023 | 3 | 2023 |
| First-Principles Calculation Guided High-Purity Layer Control of 4 in. MoS2 by Plasma RIE C Kim†, M Kim†, D Cho†, CK Kanade, H Seok, MS Bak, D Kim, WS Kang, ... Chemistry of Materials, 2023 | 3 | 2023 |
| Atomistic insights on hydrogen plasma treatment for stabilizing High-k/Si interface B Kim, M Kim*, S Yoo, SK Nam Applied Surface Science 593, 153297, 2022 | 3 | 2022 |
| Computational approach on PEB process in EUV resist: multi-scale simulation M Kim, J Moon, J Choi, B Lee, C Jeong, H Kim, M Cho* Extreme Ultraviolet (EUV) Lithography VIII 10143, 503-510, 2017 | 3 | 2017 |
| Multiscale approach for modeling EUV patterning of chemically amplified resist H Lee, M Kim, J Moon, S Park, B Lee, C Jeong, M Cho* Advances in Patterning Materials and Processes XXXVI 10960, 1096008, 2019 | 2 | 2019 |
| Temperature‐Dependent Phase Transition in WS2 for Reinforcing Band‐to‐Band Tunneling and Photoreactive Random Access Memory Application G Woo, J Cho, H Yeom, MY Yoon, GW Eom, M Kim, J Mun, HC Lee, ... Small Science 4 (2), 2300202, 2024 | 1 | 2024 |
| Lithography method using multi-scale simulation, semiconductor device manufacturing method and exposure equipment B Lee, C Jeong, B Kim, M Cho, M Kim, J Moon, S Park, H Lee, J Choi US Patent 11,493,850, 2022 | 1 | 2022 |
| Plasma and Gas‐based Semiconductor Technologies for 2D Materials with Computational Simulation & Electronic Applications C Kim†, M Kim†, S Kim, M Kang, MS Choi, HU Kim Advanced Electronic Materials, 2300835, 2024 | | 2024 |
| Artificial-Neural-Network-Driven Innovations in Time-Varying Process Diagnosis of Low-K Oxide Deposition S Lee, Y Park, P Liu, M Kim, HU Kim, T Kim Sensors 23 (19), 8226, 2023 | | 2023 |
| Lithography method using multiscale simulation, and method of manufacturing semiconductor device and exposure equipment based on the lithography method B Lee, M Cho, C Jeong, M Kim, J Moon, S Park, H Lee US Patent 11,662,665, 2023 | | 2023 |
Maenghyo ChoProfessor of Mechanical and Aerospace Engineering, Seoul National univiersityVerified email at snu.ac.kr
