| Wear behaviour of AE42+ 20% saffil Mg-MMC AK Mondal, BSSC Rao, S Kumar Tribology International 40 (2), 290-296, 2007 | 71 | 2007 |
| Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints BSSC Rao, J Weng, L Shen, TK Lee, KY Zeng Microelectronic engineering 87 (11), 2416-2422, 2010 | 66 | 2010 |
| The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy VL Niranjani, BSSC Rao, R Sarkar, SV Kamat Journal of alloys and compounds 542, 136-141, 2012 | 43 | 2012 |
| Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites VL Niranjani, BSSC Rao, V Singh, SV Kamat Materials Science and Engineering: A 529, 257-264, 2011 | 42 | 2011 |
| The effect of high energy mechanochemical processing on the microstructure, piezoelectric, ferroelectric and mechanical properties of PLZT ceramics AR James, BSSC Rao, M Pathak, SV Kamat, J Subrahmanyam Nanotechnology 19 (19), 195201, 2008 | 32 | 2008 |
| The effect of mixed mode I/III loading on the fracture toughness of Timetal 834 titanium alloy BSSC Rao, M Srinivas, SV Kamat Materials Science and Engineering: A 476 (1-2), 162-168, 2008 | 26 | 2008 |
| The effect of volume fraction of primary α phase on fracture toughness behaviour of Timetal 834 titanium alloy under mode I and mixed mode I/III loading BSSC Rao, M Srinivas, SV Kamat Materials Science and Engineering: A 520 (1-2), 29-35, 2009 | 22 | 2009 |
| Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders BSSC Rao, KM Kumar, V Kripesh, KY Zeng Materials Science and Engineering: A 528 (12), 4166-4172, 2011 | 19 | 2011 |
| Water-based gelcasting of lead zirconate titanate and evaluation of mechanical properties of the gelcast samples S Roy, BSSC Rao, J Subrahmanyam Scripta Materialia 57 (9), 817-820, 2007 | 15 | 2007 |
| Effect of temperature on fracture toughness of Timetal 834 titanium alloy under mode I and mixed mode I/III loading BSS Chandra Rao, M Srinivas, SV Kamat Metallurgical and Materials Transactions A 39, 1340-1349, 2008 | 13 | 2008 |
| Creep behaviour of SAC387 lead free solder alloy reinforced with single walled carbon nanotubes VL Niranjani, V Singh, BSS Chandra Rao, SV Kamat Transactions of the Indian Institute of Metals 68, 311-317, 2015 | 10 | 2015 |
| Evaluation of mechanical properties of gelcast lead zirconate titanate disks sintered at different temperatures S Roy, BSSC Rao, J Subrahmanyam Scripta Materialia 57 (11), 1024-1027, 2007 | 10 | 2007 |
| Structural, thermal, electromechanical and mechanical property studies on (pb0. 93la0. 07)(zr0. 60ti0. 40) o3 ceramics synthesized by a high energy mechanochemical milling process AR James, BSSC Rao, SV Kamat, J Subrahmanyam, K Srinivas, ... Smart materials and structures 17 (3), 035020, 2008 | 9 | 2008 |
| Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders BSSC Rao, KM Kumar, KY Zeng, AAO Tay, V Kripesh 2009 11th Electronics Packaging Technology Conference, 272-277, 2009 | 7 | 2009 |
| Effect of gold addition on the microstructure and mechanical properties of Sn–3.8 Ag–0.7 Cu lead-free solder alloy VL Niranjani, P Venkateswarlu, V Singh, BSS Chandra Rao, SV Kamat Transactions of the Indian Institute of Metals 71, 1497-1505, 2018 | 6 | 2018 |
| Under-Bump Metallization Contact Resistance ( ) Characterization at 10- Polymer Passivation Opening P Lianto, KJ Chui, B Bhushan, HMC Chua, L Tang, BSSC Rao, X Wang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 5 | 2017 |
| One-step TSV process development for 4-layer wafer stacked DRAM M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 673-679, 2021 | 4 | 2021 |
| Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints BSSC Rao, DM Fernandez, V Kripesh, KY Zeng 2010 12th Electronics Packaging Technology Conference, 423-428, 2010 | 4 | 2010 |
| Wafer Stacked Wide I/O DRAM with One-step TSV Technology M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui, T Kawagoe, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 143-148, 2022 | 3 | 2022 |
| Determination of tensile properties of lead-free solder joints using nanoindentation BSSC Rao, KY Zeng, V Kripesh 2010 12th Electronics Packaging Technology Conference, 309-314, 2010 | 3 | 2010 |
Samir V KamatDefence Metallurgical Research LaboratoryVerified email at dmrl.drdo.in
